applications cell phone handsets and accessories microprocessor based equipment personal digital assistants (pda?s) notebooks, desktops, and servers portable instrumentation peripherals usb interface iec compatibility pin configuration features 350 watts peak pulse power per line (tp=8/20 s) protects one i/o line (bidirectional) low clamping voltage working voltages: 3v, 5v, 8v, 12v, 15v, 24v low leakage current mechanical characteristics jedec sod-323 package molding compound flammability rating : ul 94v-o weight 5 millgrams (approximate) quantity per reel : 3,000pcs reel size : 7 inch lead finish : lead free pin configuration esd/t u sd** ser ies 0 1 | www.spsemi.cn s o d - 3 2 3 i e c 6 1 0 0 0 - 4 - 2 ( e s d ) 1 5 k v ( a i r ) , 8 k v ( c o n t a c t ) i e c 6 1 0 0 0 - 4 - 4 ( e f t ) 4 0 a ( 5 / 5 0 s ) i e c 6 1 0 0 0 - 4 - 5 ( l i g h t n i n g ) 1 2 a ( 8 / 2 0 s ) l o w c a p a c i t a n c e t v s d i o d e a r r a y rev.2014.05.01
(v) (v) @1a ( a) (pf) (max.) (min.) (ma) (max.) (max.) (@a) (max.) (typ.) 4.0 6 1 1.2 tusd08fb b c 8 . 0 8 . 5 1 5.15 6.0 TUSD03FB c c 3 . 0 0 . 6 1 9.80 18.3 8 1 13.40 18.5 8 0 . 6 storage temperature range t stg -55 ~ 150 units peak pulse power (tp=8/20s waveform) t j -55 ~ 150 maximum ratings (@ 25 unless otherwise specified) lead soldering temperature operating temperature range symbol value v c i t t l 260 (10 sec.) device characteristics v b watts parameter p pp 350 electrical characteristics per line (@ 25 unless otherwise specified) v c i r c t part number device marking v rwm 15.9 10 20 0 . 6 tusd05fb a c 5 . 0 5 1 19.00 28.6 2 lc12ci dc 12.0 13.3 6 1 0 . 6 tusd15f b tusd 2 4 f b ec 15.0 31.8 1 19.00 28.6 5 1 tusd12fb d c 1 2 . 0 1 3 . 3 1 24.00 16.7 0 . 6 hc 24.0 26.7 1 43.00 56.0 3 1 0 . 6 esd/t u sd** ser ies 0 2 | www.spsemi.cn rev.2014.05.01
sod-323 package outline & dimensions * soldering footprint esd/t u sd** ser ies 0 3 | www.spsemi.cn rev.2014.05.01
|
